电子工业中所使用的半导体材料要求纯度高,结晶缺陷低,所以要采取能获得高精度的精密加工方法。特别是随着集成电路向大规模集成电路再向超大规模集成电路发展以及集成电路的高精度化、高集成化方向的发展,有必要将硅片表面用原子级的超精密加工方法进行镜面加工。那么本文就将最近的硅片镜面研磨技术的改进和进展加以描述,而且也略谈一下其废物的处理和操作现场的安全。 Semiconductor materials used in the electronics industry require high purity and low crystal defects, so precision processing methods that achieve high precision are to be adopted. In particular, with the development of integrated circuits to large scale integrated circuits and the development of ultra-large scale integrated circuits and the development of highly integrated and highly integrated circuits, it is necessary to mirror the surface of the silicon wafer by atomic ultra-precision machining . Then this article will describe the recent improvements and advances in the mirror wafer technology, but also briefly talk about the treatment of waste and the safety of the operation site.