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结合实际生产数据,比较和分析了CSP及FTSC工艺结晶器的冷却结构及传热能力,结果表明,热流密度计算模型中,FTSC和CSP结晶器内传热区高度分别为1 200 mm和1 010 mm,相同工况下二者的传热能力相近;CSP结晶器采用42条凹型水道及20条内径11 mm的圆型水道进行组合冷却,FTSC结晶器采用72条内径14 mm的圆型水道进行冷却;弯月面处FTSC结晶器铜板热面温度高于银铜的再结晶温度,铜板将发生局部变形,这是造成镀层龟裂或铜板裂纹的主要原因。
According to the actual production data, the cooling structure and heat transfer capacity of CSP and FTSC process molds were compared and analyzed. The results show that the heat transfer area height in FTSC and CSP molds are respectively 1 200 mm and 1 010 mm, the same heat transfer capacity under the same conditions similar; CSP crystallizer using 42 concave channels and 20 circular pipes with an inner diameter of 11 mm for cooling, FTSC crystallizer with 72 diameter 14 mm circular waterway Cooling; meniscus FTSC crystallizer copper hot surface temperature is higher than the recrystallization temperature of silver and copper, the local deformation of the copper plate, which is caused by cracks in the coating or copper cracks the main reason.