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提出一种基于MEMS加工技术的新型电液动力微泵,介绍了电液动力微泵的工作机理和分类;从材料的选取,微电极的优化设计及电液动力微泵的封装工艺几方面介绍了电液动力微泵的制作过程;进行了针对不同工作流体和微通道尺寸的电液动力微泵的静压力实验和流动试验.实验结果表明:当施加90V驱动电压时,微泵最高能得到268Pa的静压头,微泵驱动流体的最大流速可以达到106μL/min;本文分析了微泵与热管相结合解决大功率电子芯片的散热问题前景,微泵所驱动的液体在热管的蒸发段完全气化,可实现的最大散热能力可达到87W/cm2.
A new type of electro-hydraulic micropump based on MEMS machining technology is presented. The working mechanism and classification of the electro-hydraulic micropump are introduced. The selection of materials, the optimal design of microelectrode and the packaging process of electro-hydraulic micropump are introduced The electro-hydraulic micro-pump manufacturing process; carried out for different working fluid and micro-channel size of the electro-hydraulic micropump static pressure test and flow test.The experimental results show that: when the application of 90V drive voltage, the highest micro-pump can be obtained 268Pa hydrostatic head, the maximum flow rate of the micro-pump driven fluid can reach 106μL / min; This paper analyzes the combination of micro-pump and heat pipe to solve the problem of heat dissipation of high-power electronic chip prospect, micro-pump driven liquid evaporation section of the heat pipe completely Gasification, the maximum cooling capacity can be achieved up to 87W / cm2.