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一、测量对象集成电路(lC)和大型集成电路(LSl)是电子技术的心脏,而加工lC 和LSl 元件的光刻装置和电子束曝光装置,是否能实现微小位移与高精度定位,又是决定元件性能的关键所在。在制造这些元件时,设备回路技术、单结晶技术、扩散技术诚然是重要的,但元件基片图样线宽精度也同样重要。目前,线宽每年以1.2倍的速度在缩小,即元件的密度以2倍的速度在缩小。如果这些极小元件的宽度、间隔等缩小n 分之一的话,则电流、也压和延迟时间等也缩小n 分之一;耗电量则下降n~2分之
First, the measurement object Integrated circuit (lC) and large integrated circuit (LSl) is the heart of electronic technology, and processing lC and LSl components lithography and electron beam exposure device, whether to achieve micro-displacement and high-precision positioning, and The key to determining component performance. Equipment circuit technology, single crystal technology, diffusion technology are certainly important in the manufacture of these components, but the accuracy of the element substrate pattern line width is equally important. At present, the bandwidth is reduced by 1.2 times per year, that is, the density of the elements is reduced by 2 times. If the width and spacing of these tiny components are reduced by a factor of n, the current, voltage, delay time and the like are also reduced by a factor of 1, while the power consumption is reduced by a factor of 2.