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本文介绍了一种制作变厚超导微桥的新方法。用此方法变厚超导微桥通过一次光刻、用三个坩埚、不必打开镀膜机就能制成。利用普通接触式紫外曝光设备和斜蒸发技术,使桥区达到亚微米尺寸。并获得了无迴滞的直流I-V特性。
This article describes a new method of making thicker superconducting microbridges. Thickened in this way superconductive micro-bridge through a lithography, with three crucibles, you do not have to open the coating machine can be made. Using common contact UV exposure equipment and oblique evaporation technology, the bridge area to sub-micron size. And obtained the non-hysteresis DC I-V characteristics.