在电子工业中,尤其是在军工、宇航等方面使用的半导体器件的生产中,为提高器件的使用效果,广泛地采用镀金工艺。这种镀层很薄,通常是2～20微米,并要求作显微硬度试验。几年来,我们在试验中发现了该试验方法上的一些问题。现提出供大家讨论。硬度试验是在Nu型立式显微镜附加的显微硬度 In the electronics industry, especially in semiconductor, aerospace and other aspects of the use of semiconductor devices, in order to improve device performance, widely used gold plating process. This coating is very thin, usually 2 to 20 microns, and require microhardness test. In recent years, we have found some problems in this test method in the experiment. Now for discussion. The hardness test is an additional microhardness on a Nu-type vertical microscope