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在无溶剂条件下,采用熔融缩聚法制备了一系列DHDPS(二苯基硅二醇)、PTS(聚甲基三乙氧基硅烷)改性EP(环氧树脂);然后以此为基体树脂,将其与酸酐固化剂、促进剂和颜填料等共混后,制成粉末包封料;最后将该包封料与溶剂混合均匀后,制成包封浆料。研究结果表明:DHDPS、PTS均分别与EP发生了接枝共聚反应;当m(EP)∶m(DHDPS)=100∶30、m(EP)∶m(PTS)=100∶20时,两者失重50%时的热分解温度分别比改性前提高了94.7℃和115.3℃,750℃时的残炭率也分别提高了7.9%、14.2%;两者的理化性能均符合技术指标要求,但后者的冻融稳定性更好,前者的包封浆料的适宜黏度为170~200 mPa·s。
A series of DHDPS (diphenylsilanediol) and PTS (polymethyltriethoxysilane) modified EP (epoxy resin) were prepared by melt polycondensation under solvent-free conditions. Then, , With the anhydride curing agent, accelerators and pigments and fillers, etc., after the formation of powder encapsulant; Finally, the encapsulant and the solvent mixture, made of encapsulated slurry. The results showed that both DHDPS and PTS were grafted with EP respectively. When m (EP): m (DHDPS) = 100:30 and m (EP): m The thermal decomposition temperature increased by 94.7 ℃ and 115.3 ℃ respectively at 50% weight loss and 7.9% and 14.2% at 750 ℃, respectively. The physical and chemical properties of both were in line with the technical requirements, The latter freeze-thaw stability is better, the former suitable viscosity of encapsulated slurry 170 ~ 200 mPa · s.