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采用铸轧法获得宽幅层状铜-铝复合板,并研究了不同退火温度对铜-铝复合板界面组织和力学性能影响,探讨了界面金属间化合物作用机理,结果表明:退火温度越高,界面扩散越明显,金属间化合物越多;铜基体界面处率先生成Cu_9Al_4,铝基体界面处率先生成CuAl_2,随着铜、铝元素扩散会有CuAl生成;界面层硬度高于其它位置,由于基体软化和金属间化合物的共同作用;300℃退火铜-铝复合板界面组织和力学能性能最佳,扩散层厚度13.63μm左右,抗拉强度101.9 MPa,伸长率32.0%。
The effects of different annealing temperature on the microstructure and mechanical properties at the interface of copper-aluminum composite board were studied. The mechanism of intermetallic compounds was discussed. The results showed that the higher annealing temperature , The more interfacial diffusion and the more intermetallic compounds. Cu_9Al_4 was the first to form at the interface of copper matrix and the first to CuAl_2 at the interface of aluminum matrix. With the diffusion of Cu and Al, CuAl would be formed. The hardness of interfacial layer was higher than that of other sites. Softening and intermetallic compounds. The microstructure and mechanical properties of the annealed copper-aluminum composite plate at 300 ℃ are the best. The thickness of diffusion layer is about 13.63μm, the tensile strength is 101.9 MPa and the elongation is 32.0%.