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用自己组装的能测量达纳米量级微小位移的激光测微装置测定了不同固化剂Ｔ３１—环氧树脂体系的线膨胀系数，并由膨胀系数的转折来求取该固化体系的玻璃化温度随Ｔ３１含量的变化。实验表明，Ｔ３１固化剂确是低膨胀系数的良好固化剂。
The linear expansion coefficient of different curing agent T31-epoxy resin system was measured by the laser micrometer assembly which can measure nanometer scale microdisplacement. The glass transition temperature of the curing system T31 content changes. Experiments show that, T31 curing agent is indeed a good low coefficient of expansion curing agent.