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采用粉末注射成形技术制备了SiCP体积含量分别为5%、10%和15%的SiCP/Cu复合材料,对该复合材料的显微组织、显微硬度和抗拉强度进行了检测,观察了拉伸断口的形貌,对拉伸断口进行了能谱分析。结果表明:SiC颗粒较均匀地分布在Cu基体中;随着SiCP含量的增加,该复合材料的硬度增大,而抗拉强度先增大后减小;该复合材料拉伸断裂的裂纹源主要为SiC颗粒附近Cu基体的开裂、SiC颗粒与Cu基体界面的脱粘两种情况;在氢气气氛条件下烧结得到的该复合材料中不含O元素。
The SiCP / Cu composites with 5%, 10% and 15% SiCP contents were prepared by powder injection molding. The microstructure, microhardness and tensile strength of the composites were measured. Tensile fracture morphology, the tensile fracture analysis of the energy spectrum. The results show that the SiC particles distribute uniformly in the Cu matrix. With the increase of SiCP content, the hardness of the composite increases and the tensile strength first increases and then decreases. The source of tensile fracture of the composite is mainly Which is the case of cracking of the Cu matrix near the SiC particles and the debonding of the interface between the SiC particles and the Cu matrix. The composite material obtained by sintering under a hydrogen atmosphere contains no O element.