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本文概述正在研制中的各种互连电路,可用于单片和混合式工艺,内容包括: 1.互连电路功能信号输入阻抗匹配信号控制背景抑制 2.对兼容性的要求金属氧化物半导体(MOS)工艺
This article provides an overview of the various interconnect circuits under development for use in monolithic and hybrid processes, including: 1. Interconnect circuit functions Signal Input Impedance Matching Signal Control Background Suppression 2. Compatibility Requirements Metal Oxide Semiconductor MOS) process