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本文所述模三检查方法,曾用于一种小规模集成电路计算机中,以实现故障检查、恢复与定位等功能要求。为了适应大规模集成电路的特点,并充分利用它所提供的新的技术可能性,现将模三检查等功能归纳成为一种模三检查器组件,而且将故障恢复安排在微指令一级进行。由此,在相应微处理机的结构很少变化的情况下,就可以完成故障检查、恢复与定位等功能要求。除此之外,将此方法推广到超大规模集成电路的情形,也是很直接的。
This article describes the three modal inspection methods, used in a small-scale integrated circuit computer, in order to achieve fault detection, recovery and positioning and other functional requirements. In order to meet the characteristics of large scale integrated circuits, and make full use of the new technological possibilities it provides, the functions of modulo-three checking are now summarized into a modular three-checker assembly and the fault recovery is arranged at the micro-instruction level . Thus, in the case of the corresponding little change in the microprocessor case, you can complete fault checking, recovery and positioning and other functional requirements. In addition, it is straightforward to extend this method to very large scale integrated circuits.