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美国应用材料(Applied Materials,AMAT)与美国诺发系统(Novellus Systems)在3维封装用TSV(硅贯通过孔)技术上的开发竞争日益激烈。AMAT在
Applied Materials (AMAT) and Novellus Systems (USA) have become increasingly competitive in the development of TSV technology for 3-D packaging. AMAT is there