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针对航空领域高性能微细零件的需要,本文用超声辅助的方法对电铸铜进行机械后处理,并得到了具有纳米结构的电铸铜层。分别用金相显微镜、扫描电子显微镜和透射电子显微镜观察了电铸铜层的微观新貌,用拉伸测试仪测试了其拉伸性能。实验结果表明,经过超声辅助机械处理后,电铸铜层整体仍然保持着单晶结构取向特征,但其表层晶粒却由粗大的块状晶变成了约10纳米左右的纳米晶。与常规电铸铜层相比,经过超声辅助机械处理的电铸铜层的抗拉强度提高了一倍,并且塑性保持不变。最后,对其机理进行分析并证实了其增强机制为位错强化。
In order to meet the need of high-performance micro parts in aeronautical field, this paper uses ultrasonic-assisted method to mechanical post-process the electroformed copper and obtains the electroformed copper layer with nanostructures. The microscopic new appearance of the electroformed copper layer was observed with a metallographic microscope, a scanning electron microscope and a transmission electron microscope, respectively. The tensile properties of the electroformed copper layer were tested by a tensile tester. The experimental results show that after the ultrasonic assisted mechanical treatment, the electroformed copper layer still retains the single crystal structure orientation characteristics, but the surface grains from coarse massive crystal into about 10 nanometers of nanocrystals. The tensile strength of the electroformed copper layer after ultrasonic assisted mechanical treatment has been doubled compared to conventional electroformed copper layers, and the ductility remains unchanged. Finally, the mechanism is analyzed and its enhancement mechanism is proved to be dislocation enhancement.