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针对微热板阵列建立了热路模型,并对热干扰进行分析.结果表明,由于微热板悬空结构的热阻比硅芯片的热阻高3个数量级,因此微热板阵列芯片的热干扰温度取决于封装对环境的热阻,而芯片上器件的间距对热干扰温度的影响可以忽略.研制了3种布局、TO5和DIP16两种封装形式的微热板阵列,并对阵列中的热干扰问题进行了实验测试.测试数据验证了热路模型的结论.因此,减小微热板阵列或集成芯片的热干扰的关键在于,尽可能增大微热板悬空结构的热阻以及选用热阻小的封装形式.
The thermal model was established for the micro-thermal plate array and the thermal interference was analyzed.The results show that the thermal interference of the micro-thermal plate array chip is three orders of magnitude higher than the thermal resistance of the silicon chip due to the thermal resistance of the micro-thermal plate structure, The temperature depends on the package’s thermal resistance to the environment, and the influence of the pitch of the device on the chip on the thermal interference temperature can be neglected.Three kinds of layouts, the TO5 and the DIP16 packages, Interference test, the test data verify the conclusion of the thermal circuit model.Therefore, the key to reduce the thermal interference of the micro-thermal plate array or integrated chip is to increase the thermal resistance of the suspended structure of the micro-thermal plate as much as possible, Small resistance of the package.