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为了减少和避免镀金过程中剧毒物质氰、腈的使用,以巯基乙酸为配体合成了一种新型亚金配合物巯基乙酸亚金铵;采用试金法和元素分析仪分析了其成分,用红外光谱、紫外光谱、热失重分析和导电性测量等研究了其基本理化性质,并将其用于电镀金。结果表明:合成产物的分子式为NH4[Au(MA)2]·H2O,以巯基乙酸的巯基和金配位为成键特征,在200℃之前热稳定性较好;以NH4[Au(MA)2]·H2O为金源,通过四因素三水平的正交试验获得了最佳镀金参数:电流密度200~300 A/m2,光亮剂十二烷基磺酸钠浓度5~8 m L/L,温度35~50℃,金浓度15~25 g/L;所得电镀金层表面光滑,颗粒尺寸在0.5~1.0μm内为单质金,均匀性好,镀层色泽、结合力优良。
In order to reduce and avoid the use of highly toxic cyanides and nitriles in the gold plating process, a new type of gold subunit of thioglycolic acid was synthesized by using thioglycolic acid as ligand. The composition, The basic physical and chemical properties were studied by infrared spectroscopy, ultraviolet spectrum, thermogravimetric analysis and conductivity measurement, and used for gold electroplating. The results show that the molecular formula of the synthesized product is NH4 [Au (MA) 2] .H2O, the mercapto and gold coordination of thioglycolic acid is the bonding characteristic, and the thermal stability is better before 200 ℃. 2] · H2O as the gold source, the optimum gold plating parameters were obtained through orthogonal experiment of four factors and three levels: current density of 200-300 A / m2, brightener sodium dodecyl sulfate concentration of 5-8 m L / L , The temperature is 35-50 DEG C and the gold concentration is 15-25 g / L. The surface of the obtained gold electroplated layer is smooth and the grain size is in the range of 0.5-1.0 micrometers, the uniformity is good, and the coating color and the bonding force are excellent.