:近年来 ,微型机电系统技术高速发展 ,对作为其基础技术的微细加工设备的需求也越来越大。重点讨论接近式深度光刻机的掩摸和硅片间的衍射 ,其中对掩模与硅片间的夫琅和费衍射和菲涅尔衍射进行了区别 ,并提出了接近深度光刻机掩模-硅片间的衍射应属于菲涅尔衍射 ,同时具体分析单缝型掩模的菲涅尔衍射公式。对深入理解和认识接近式深度光刻机的掩模 -硅片间衍射的物理本质提供了更为方便的研究手段。 : In recent years, the rapid development of micro-electromechanical systems technology, the demand for micro-processing equipment as its basic technology is also growing. Focusing on the masking of near-type depth lithography and diffraction between silicon wafers, the difference between the Fraunhofer diffraction and Fresnel diffraction between the mask and the silicon wafer is discussed, and a near-depth lithography mask is proposed The diffraction between the mold and the silicon should belong to the Fresnel diffraction, and the Fresnel diffraction formula of the single-slit mask should be analyzed in detail. It provides a more convenient research method for understanding and understanding the physical nature of the inter-silicon diffraction mask.