更细的设计规则、更小的缺陷类型、更多的噪声源和新的工艺整合方案,给原本有效的在线晶片检测方法带来了严峻挑战。通过描绘在线检测到的良率限制缺陷的量值以及它们对在线和最终测试良率的影响程度,往往可以获得良率改进最佳方法。 Smaller design rules, smaller defect types, more sources of noise and new process integration solutions pose serious challenges to the already effective online wafer inspection methods. By plotting the magnitude of yield-detected defects detected online and their impact on the online and final test yields, the best way to improve yields is often found.