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研究了一种制备超细Ni/Cu包覆型复合粉的新工艺。以硫酸铜和硫酸镍为原料、酒石酸铵为络合剂、NaOH调节pH值、水合肼还原的化学共沉积法,制备了平均粒径为50nm的纳米级镍包铜(Ni/Cu)复合粉末。并从电化学、结晶学的角度阐述了制备粒度微细、包覆均匀的Ni/Cu复合粉末的基本原理。该方法利用液-液均相置换反应,采用温和的反应条件,直接制备纳米级复合粉末材料,具有方法简单、粉末粒度均匀、产品纯度高等优点。
A new process for preparing ultrafine Ni / Cu coated composite powders was studied. Nanometer nickel-clad copper (Ni / Cu) composite powder with average diameter of 50nm was prepared by chemical co-deposition method with copper sulfate and nickel sulfate as raw materials, ammonium tartrate as complexing agent, NaOH pH adjustment and hydrazine hydrate reduction . The basic principle of preparing Ni / Cu composite powder with fine particle size and uniform coating was described from the aspects of electrochemistry and crystallinity. The method utilizes liquid-liquid homogeneous phase displacement reaction and adopts mild reaction conditions to directly prepare nanometer composite powder materials, and has the advantages of simple method, uniform powder particle size and high product purity.