英飞凌在智能卡市场有25年经验,在全球智能卡与安全芯片市场占有率连续15年位居第一。近日,英飞凌科技(中国)公司智能卡与安全部门中国区经理潘晓哲介绍了其最新的三大创新。存储:从ROM到EEPROM智能卡芯片的ROM会转移到EEPROM。因为首先是性能的提升和功耗的降低,半导体业来说关键之一是线宽。线宽从最早的0.22 μm(220 nm)下降到了0.13 μm(130 nm),英飞凌现在推广 Infineon has 25 years of experience in the smart card market, ranking No.1 in the global smart card and security chip market share for 15 consecutive years. Recently, Infineon Technologies (China) Co., Ltd. China smart card security manager Pan Xiaozhe introduced its latest three major innovations. Storage: ROM from ROM to EEPROM smart card chip ROM will be transferred to the EEPROM. Because the first is the performance improvement and power consumption reduction, the semiconductor industry is one of the key line width. The linewidth has dropped from the earliest 0.22 μm (220 nm) to 0.13 μm (130 nm), and Infineon now markets