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集成电路正向高性能、高集成度、高速度和低功耗方向迅速发展.由于其图形加工技术的提高和CAD技术的实用化,使芯片面积进一步增大,各元件间连线所占面积的比例也必然大大增加,因而采用较小的金属间距(条宽十间隙)和多层布线技术便成为一种必不可少的工艺手段.尤其对双极LSI,低功耗、微细化和多层布线更是关键的工艺基础,对提高成品率、降低成本尤为重要.
Integrated circuits are moving toward the direction of high performance, high integration, high speed and low power consumption. Due to the improvement of its graphics processing technology and the practical use of CAD technology, the area of the chip is further increased, and the area occupied by the connections among the components The proportion of the inevitable greatly increased, so the use of smaller metal pitch (strip width ten gaps) and multi-layer wiring technology has become an indispensable technology means, especially for bipolar LSI, low power consumption, miniaturization and more Layer wiring is the key process foundation, to improve the yield, reduce costs is particularly important.