以前半导体制造和掩模生产用的电子束描画设备需用分离的图形发生设备来控制各单束,然而日立有限公司的工程师们通过提高图形发生器的性能已改变了这一现状,使设备可同时进行多束电子束控制,从而有效地提高了生产率。 进行这一研究的主要原因之一是:日立公司考虑到,随着自动化设备在半导体生产中应用的增长,公司必须有一个专门的可靠来源,经过研究,他们发现最好的来源在于公司的本身,于是在保证为市场提供新产品的同时,公司加速了新设备关键机械的研究。 为了缩短定制产品的生产周期,减少生产费用,多束电子束设备采用在晶片上直接描画的方式提高生产力。同时这种设备也可用来为光学光刻和X射线光刻设备生产多重掩模或中间版。同其它电子束设备一样,采用此设备可 Previous electron beam lithography equipment for semiconductor manufacturing and mask production required separate patterning devices to control individual beams, but Hitachi, Ltd. engineers have changed this situation by increasing the performance of the pattern generator so that the device can be Simultaneous multi-beam electron beam control, thus effectively improving the productivity. One of the main reasons for this research is that Hitachi considers that with the growth in the use of automation equipment in semiconductor manufacturing, companies must have a dedicated and proven source of research that they find best sourced by the company itself , The company accelerated the research on the key machinery of the new equipment while guaranteeing to provide the market with new products. In order to shorten the production cycle of customized products and reduce the production cost, the multi-beam electron beam apparatus adopts the method of direct drawing on the wafer to improve the productivity. The device can also be used to produce multiple masks or intermediate plates for optical lithography and X-ray lithography equipment. As with other electron beam devices, use this device