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2015年6月8日,英飞凌科技股份公司推出发挥英飞凌新一代IGBT优势的最新一代PrimePACK TM功率模块。IGBT5和创新的.XT技术结合,是IGBT芯片和模块技术发展的一个重要里程碑。IGBT5降低静态和动态功率损耗,提高功率密度,而.XT模块工艺技术可通过增强热管理和功率循环周次延长产品寿命。因此,全新推出的PrimePACK TM模块成为了风电、光伏和工业传动等应用大部分高功率逆变器的最佳选择。新推出的PrimePACK TM功率模块采用英飞凌最新推出的IGBT5芯片,其最高工作结温(Tvjop)提高了25K,可达到175°C。与前代产品相比,IGBT5芯片具备更出色的软开关性能,总功率损耗更低。这可提高采用1200V和1700V
On June 8, 2015, Infineon Technologies AG introduced the latest generation of PrimePACK TM power modules that leverage the new generation of IGBTs from Infineon. The combination of IGBT5 and innovative .XT technology is an important milestone in the development of IGBT chip and module technology. IGBT5 reduces static and dynamic power losses and increases power density, while .XT module technology extends product life by enhancing thermal management and power cycling. Therefore, the new PrimePACK TM module is the best choice for most high-power inverters used in wind power, photovoltaic and industrial drives. The new PrimePACK TM power module incorporates the latest IGBT5 chip from Infineon with a 25K increase in Tvjop up to 175 ° C. Compared with the previous generation IGBT5 chips have better soft-switching performance, lower total power loss. This can be increased by 1200V and 1700V