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采用真空电弧炉熔铸+喷射成形技术,以Cu-0.5Cr-0.2Zr-0.02Y-0.02(0.55La+0.45Ce)为名义成分,通过在石墨坩埚熔铸过程中原位自生成的Cr碳化物制备了颗粒增强Cr3C2/Cu复合材料。研究了该材料的显微组织、力学性能和电学性能。结果表明:经压延变形和时效处理后,该材料的显微组织特征是以稳定的等轴晶α-Cu相为基;经90%压延变形+490℃时效45min处理后,该材料性能为显微硬度Hv100182.7,导电率83.5IACS%,此时显微硬度和导电率配合良好,已达到超大规模集成电路引线框架材料所要求的主要性能指标。
Using vacuum arc furnace casting + spray forming technology, with the nominal composition of Cu-0.5Cr-0.2Zr-0.02Y-0.02 (0.55La + 0.45Ce), prepared by in-situ self-generated Cr carbides during the graphite crucible casting process Particle Reinforced Cr3C2 / Cu Composites. The microstructure, mechanical properties and electrical properties of the material were studied. The results show that the microstructure of the material is characterized by the stable equiaxed α-Cu phase after rolling deformation and aging treatment. The properties of the material after being rolled by 90% calendering and aging at 490 ℃ for 45 min are obviously Microhardness Hv100182.7, conductivity 83.5IACS%, at this time the microhardness and conductivity with good, has reached the VLSI lead frame material required for the main performance indicators.