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关于解决计算机的热设计问题,在进行理论分析的同时,近几年来,已付诸具体实施,各种方法正在民用设备得到实际的应用。特别是在大规模集成电路计算机方面,基本逻辑元件的高速化、低能量化、高集成化、高可靠性、和低成本都取得迅速进展,这些因素直接或间接都是以温度为参数的函数,计算机硬件系统的性能估价不是可以看作是将“由元件可直接得到的性能”和“用热设计能得到的冷却效率”作为系数的乘积吗?本文介绍大规模集成电路热设计时应注意的事项,最后介绍 ACOS 计算机系统中采用的冷却方式。
Regarding the solution to the thermal design problem of computers, while conducting theoretical analysis, in recent years, concrete implementation has been put into practice, and various methods are being applied to civilian devices. Especially in large-scale integrated circuit computers, rapid progress has been made in speeding up, lowering of energy consumption, high integration, high reliability, and low cost of basic logic elements. These factors are directly or indirectly functions of temperature, Is not performance evaluation of a computer hardware system as a product of multiplying the coefficients “What can be achieved directly from the components” and “Cooling efficiency from the thermal design?” This article describes the thermal design of large scale integrated circuits Matters, and finally describes the cooling methods used in ACOS computer systems.