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一、前言 半导体器件的封装,主要为玻璃封装、陶瓷封装、金属封装及塑料封装几种形式。前三种封装,在封装材料及封装工艺上,半个多世纪以来,作了大量的工作,总结出了较成熟的经验,其器件的可靠性享有较高的信誉。 塑料封装的半导体器件,虽然在世界工业发达的国家已有二十几年的历史,但在我国大量采用塑料封装,还是近几年的事情。 我厂塑料封装发展很快,从78年引进设备、模具、材料开始,发展到现在可全部采用国产设备、模具、材料。音响电路系列如FS34、FS315、FS30、FS820、FS2204、FS1083等全部采用塑料封装。生产数量达几百万,质量全部符合部颁SJ331-72总技条件标准,参数
I. Introduction The semiconductor device package, mainly for glass packaging, ceramic packaging, metal packaging and plastic packaging in several forms. The first three packages, in the packaging materials and packaging technology, more than half a century, made a lot of work, summed up the more mature experience, the reliability of their devices enjoy a high reputation. Although plastic encapsulated semiconductor devices have been in the industrialized countries in the world for more than 20 years, extensive use of plastic encapsulation in our country is still a matter in recent years. I plant the rapid development of plastic packaging, from 78 years the introduction of equipment, molds, materials began to develop all the equipment now available in China, molds, materials. Audio circuit series such as FS34, FS315, FS30, FS820, FS2204, FS1083, etc. all in plastic package. Production amounted to several million, all in line with the quality of ministerial SJ331-72 General technical conditions, the parameters