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关于计算机散热设计问题,近年来在进行理论研究的同时,也就散热设计的近似方法做了一些探索。对LSI电子计算机来说,由于逻辑元件不断向高速、低功耗、高集成度、高可靠及低成本发展,而这些指标又都与温度有关,所以计算机的设计性能正是以“基于元件所期待的性能”和“散热设计所获得的冷却效率”作为系数综合考虑的结果。本文主要叙述LSI在散热设计上需注意的几个问题。
On the computer cooling design, in recent years, theoretical research at the same time, also on the thermal design of the approximate method to do some exploration. For LSI computers, because of the continuous development of logic elements toward high speed, low power consumption, high integration, high reliability and low cost, these indicators are all related to temperature, so the design performance of the computer is based on “ Expected performance ”and“ cooling efficiency obtained by the thermal design ”as a result of a comprehensive consideration of the coefficients. This article describes the LSI thermal design in several issues to be aware of.