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提出了一种对微电子封装器件中焊点剪切强度进行测试的方法,可有效降低测试误差。利用该方法,对Sn-Ag-Cu无铅焊料分别在Cu基板和Ni-P基板上形成的焊点,经不同的热时效后的剪切强度进行了测量,并对断裂面的微观结构进行了研究。结果表明,新的剪切测试方法误差小,易于实施,焊点剪切强度、断裂面位置与焊料在不同基板界面上金属间化合物的形貌、成分有关。
A method of testing the shear strength of solder joints in microelectronic packages is proposed, which can effectively reduce the test error. Using this method, the solder joint of Sn-Ag-Cu lead-free solder on Cu substrate and Ni-P substrate respectively was measured by different thermal aging shear strength and the microstructure of the fracture surface was measured Study. The results show that the new shear test method has small error and is easy to implement. The shear strength of solder joint and the location of fracture surface are related to the morphology and composition of intermetallic compounds of solder on different substrate interfaces.