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介绍了一种用于铜膜化学机械抛光的多元胺醇型非离子表面活性剂。研究了该表面活性剂对抛光液表面张力、黏度、粒径、抛光速率和抛光后铜的表面状态的影响。抛光液的基本组成和工艺条件为:SiO2 0.5%,H2O2 0.5%,FA/OII型螯合剂5%(以上均为体积分数),工作压力2 psi,抛头转速60 r/min,抛盘转速65 r/min,抛光液流量150 mL/min,抛光时间3 min,抛光温度21°C。结果表明,微量表面活性剂的加入能显著降低抛光液的表面张力并大幅提高抛光液的稳定性,但对静置24 h后抛光液黏度的影响不大。表面活性剂含量为0%～2%时,随其含量增大,化学机械抛光速率减小,抛光面的粗糙度降低。
A kind of polyamine alcohol nonionic surfactant for chemical mechanical polishing of copper film is introduced. The effects of the surfactant on the surface tension, viscosity, particle size, polishing rate and surface state of the polished copper were investigated. The basic composition and process conditions of the polishing solution are: SiO2 0.5%, H2O2 0.5%, FA / OII chelator 5% (all above volume fraction), working pressure 2 psi, throw speed 60 r / min, r / min, polishing liquid flow 150 mL / min, polishing time 3 min, polishing temperature 21 ° C. The results show that the addition of micro-surfactant can significantly reduce the surface tension of the polishing solution and greatly improve the stability of the polishing solution, but has little effect on the viscosity of the polishing solution after standing for 24 h. When the content of surfactant is 0% ~ 2%, with the increase of its content, the chemical mechanical polishing rate decreases and the roughness of polishing surface decreases.