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本文介绍了由美国环境保护署(EPA)和美国电子工业联合资助进行的含铅和两种无铅替代钎料的生命周期评价结果。报导的影响值为波峰焊中的16个不同的环境条目。评价的钎料棒有锡铅、锡银铜和锡铜。结果认为锡铅钎料在4个方面的影响值高于无铅钎料,而另5个方面却低于无铅钎料。使用及应用阶段对多数影响值起主要作用。而对不同的钎料,上游阶段和用后处理工艺也对几个特定的影响条目起重要作用;文中还报导了银的生产影响和填埋渗滤数据的敏感性分析。
This article describes the life cycle assessment of lead and two lead-free alternative brazes jointly funded by the U.S. Environmental Protection Agency (EPA) and the U.S. electronics industry. The reported impact value is 16 different environmental entries in wave soldering. Evaluation of the solder rod tin-lead, tin silver copper and tin copper. The results show that the impact of tin-lead solder in four aspects higher than the lead-free solder, while the other five areas are lower than the lead-free solder. The use and application phases play a major role in most impact values. Several different influencing items also play an important role for different brazing materials, upstream stages and after-treatment processes. Sensitivity analyzes of silver production impacts and landfill percolation data are also reported.