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研究了铝丝-镀金层系统的健合强度的退化。这种健合系统在高温贮存时,健合强度的退化为下列三种退化模式之一:(ⅰ)A模式—随热退火时间的增加,键合强度下降,直到某一确定值,(ⅱ)B模式—在一确定的退火时间以后,键合强度开始分成两个值,(ⅲ)C模式—键合强度迅速降到零。在铝-金界面之间富金金属间化合物相处生成的Kirkendall空洞可圆满地解释这三种退化模式的物理机理,此时,富金金属间化合物相的生长速率对决定退化模式起着非常重要的作用。当金层含有大量的铅或铊时,这个生长速率减慢,退化是C模式或者是B模式。有时在金层中掺入银,能使键合强度的退化减弱。
The degradation of the fitness strength of the aluminum wire-gold plating system was investigated. The degradation of fitness strength during storage at high temperatures is one of the following three degenerate modes: (i) Mode A - as the thermal annealing time increases, the bond strength decreases until a certain value is established (ii ) B mode - bond strength begins to split into two after a defined annealing time, (iii) C mode - bond strength drops rapidly to zero. The Kirkendall voids generated by the coexistence of Au-rich intermetallics at the Au-Au interface can satisfactorily explain the physical mechanism of these three degenerate modes, at which point the growth rate of the Au-rich intermetallic phase plays an important role in determining the degeneration mode Role. When the gold layer contains a large amount of lead or thallium, this growth rate slowed down, the degradation is C mode or B mode. Silver is sometimes incorporated in the gold layer to weaken the degradation of bond strength.