激光一般用来去除金属导体上覆盖的有机绝缘材料。这项工作大多通过CO2和准分子激光器来完成，但有些公司提供固体激光器的工具成品来进行高产量打孔作为标准产品。本文讨论三种借助激光进行选择性材料去除的典型应用：导线外层护套的剥除、柔性电路加工和paralene的去除。本文 Laser is generally used to remove the organic insulating material covered by the metal conductor. Most of this work is done with CO2 and excimer lasers, but some companies offer finished tools for solid-state lasers for high throughput drilling as standard products. This article discusses three typical applications for laser removal of selective materials: stripping of the outer sheath of the wire, processing of flexible circuits, and removal of paralene. This article