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高功耗封装的传热设计需要精确地测量热由芯片结面传到IC封装外壳的热阻值,即θ_(jc)值,用以设计合适的外接散热器。对于热阻值较小的封装来说,由于难以精确获得封装外壳温度值,θ_(jc)的测量和确定具有相当的挑战性。本文研究了四种封装外壳温度的测量方法,包括光测量,弹簧接触,冷板中嵌入热电偶,和热电偶粘贴到封装外壳等方法。测试结果表明,不准确的封装外壳温度测量会导致较大的θ_(jc)的误差。我们开发了一种温度校正标准装置来比较各种测试方法的误差。结果表明,弹簧接触式和光测试方法在测试封装外壳温度时所需的修正较小。
High-power package heat transfer design requires accurate measurement of thermal resistance from the chip surface to the IC package shell thermal resistance, that θ_ (jc) value, to design a suitable external heat sink. For packages with lower thermal resistance, measurement and determination of θj (jc) can be quite challenging due to the difficulty of accurately obtaining package case temperature values. This article studies four methods for measuring the temperature of a package’s enclosure, including light measurement, spring contact, thermocouples embedded in the cold plate, and the attachment of a thermocouple to the package’s enclosure. Test results show that inaccurate package case temperature measurement can lead to large θj (jc) errors. We have developed a temperature calibration standard device to compare the error of various test methods. The results show that the spring-contact and optical test methods require less revisions to test the package case temperature.