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Electroless Ni-Cu-P deposits were deposited on the Si substrate in a basic hypophosphite-type plating bath. The effects of pH value and the metal source composition,Ni and Cu,in the plating bath on the kinetics of the Ni-Cu-P deposition were studied. The electroless Ni-Cu-P deposits were characterized by a scanning electron microscope,a transmission electron microscope,an energy dispersive X-ray spectroscope,and an X-ray diffractometer. The results showed that the pH value of the plating bath had no ob-vious effect on the morphology and composition of electroless Ni-Cu-P deposits. However,the composition of the metal source,Ni and Cu,in the plating bath had great effect on the kinetics of electroless Ni-Cu-P deposition.
Electroless Ni-Cu-P deposits were deposited on the Si substrate in a basic hypophosphite-type plating bath. The effects of pH value and the metal source composition, Ni and Cu, in the plating bath on the kinetics of the Ni-Cu- The electroless Ni-Cu-P deposits were characterized by a scanning electron microscope, a transmission electron microscope, an energy dispersive X-ray spectroscope, and an X-ray diffractometer. The results showed the pH value of the plating the composition of the metal of Ni and Cu, in the plating of had no ob-vious effect on the morphology and composition of electroless Ni-Cu-P deposits. However, the composition of the metal source, Ni and Cu, in the plating bath had great effect on the kinetics of electroless Ni-Cu -P deposition.