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采用扫描电镜 (SEM )、电子探针 (EPMA)、显微硬度等测试方法对Cu/Al扩散焊工艺以及接头的组织性能进行了分析。试验结果表明 :采用真空扩散焊工艺 ,在加热温度 ( 5 2 0～ 5 40 )℃、保温时间 6 0min、压力 11.5MPa时 ,在Cu/Al界面处形成明显的宽度约 40 μm的扩散过渡区。由于在铜侧过渡区中产生金属间化合物 (Cu3Al)会出现硬度峰值。控制Al的扩散含量不超过 10 % ,可避免或减少扩散过渡区中脆性金属间化合物的产生
The Cu / Al diffusion bonding process and the microstructure and properties of the joints were analyzed by scanning electron microscopy (SEM), electron probe (EPMA) and microhardness test. The experimental results show that the diffusion-diffusion zone with a width of about 40 μm is formed at the Cu / Al interface at the temperature of (520 ~ 540 ℃), the holding time of 60 min and the pressure of 11.5 MPa by vacuum diffusion welding . The hardness peak appears due to the generation of the intermetallic compound (Cu3Al) in the copper side transition zone. Controlling the diffusion of Al up to 10% avoids or reduces the generation of brittle intermetallics in the diffusion transition zone