无论从技术还是从经济方面来讲,人们都要求采用先进的硅片光刻技术。这就迫切要求各种硅片步进光刻机在性生能上有所改进。预计,特征尺寸将越来越小,对于套刻精度的要求也会越来越严格。这一发展趋势迫切要求光刻系统能适应宽范围的生产条件、具有多层抗蚀剂加工能力及调整时间短,而且可靠性要进一步提高。本文对于这些新的要求中的某些项目进行了评述,介绍了为适应这些要求而开发的一种新型硅片步进光刻机及其在模拟的生产环境下所获得的性能数据。 People require the use of advanced silicon lithography, both technically and economically. This urgently requires a variety of silicon stepper lithography machine can improve on the students. It is expected that feature sizes will become smaller and smaller, and the requirements for overlay accuracy will also become more stringent. This development trend urgently requires the lithography system to adapt to a wide range of production conditions, has a multi-layer resist processing ability and a short adjustment time, and the reliability needs to be further improved. This paper reviews some of these new requirements and describes a new silicon wafer stepper that has been developed to meet these requirements and the performance data obtained in a simulated production environment.