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利用阵列微电极技术测量了金属铜的自腐蚀电位、阻抗及表面腐蚀产物膜层载流子密度,并结合扫描电子显微镜,研究了Nd3+对金属铜在3.5%(w)NaCl溶液中腐蚀电化学行为的影响.结果表明,加入Nd3+使得金属铜表面生成的腐蚀产物膜层的形貌及结构发生了变化,腐蚀产物膜层变薄,腐蚀产物由片状结构转变为粒状结构,颗粒均匀分散分布;Nd3+的存在使得金属铜表面各区域的电位方差由0.034下降为0.026,阻抗标准方差由32805下降为6940,电位及阻抗分布趋于均匀化,有利于抑制局部腐蚀的发生;并且加入Nd3+将造成金属铜表面绝大部分区域腐蚀产物膜层的半导体类型由n型转变为p型,表面腐蚀产物膜层载流子密度标准方差由1.89×1017上升为4.10×1017,载流子密度分布趋于不均匀.
The self-corrosion potential and impedance of metal copper and the carrier density of surface corrosion products were measured by array microelectrode technique. The corrosion electrochemistry of Nd3 + in 3.5% (w) NaCl solution was investigated by scanning electron microscopy The results show that the addition of Nd3 + causes the morphology and structure of the corrosion products formed on the copper surface to change, and the corrosion products become thinner and the corrosion products change from the sheet structure to the granular structure, and the particles are uniformly distributed ; The existence of Nd3 + makes the potential variances of all regions of metal copper decrease from 0.034 to 0.026, the standard deviation of impedance decreases from 32805 to 6940, and the distribution of potential and impedance tends to be uniform, which helps to suppress the local corrosion; and the addition of Nd3 + The semiconductor type of the corrosion product film on the metallic copper surface changed from n-type to p-type. The standard deviation of the carrier density of the surface corrosion product film increased from 1.89 × 1017 to 4.10 × 1017 and the carrier density distribution tended to Inhomogeneous.