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通过化学镀的方法对碳化硅颗粒表面进行了镀铜改性,采用无压渗透法制备了镀铜碳化硅颗粒铝基复合材料。对碳化硅颗粒镀铜前后SiCp/Al复合材料进行动电位极化曲线和电化学阻抗谱测试。结果表明:SiC颗粒化学镀铜后,颗粒完全由Cu包覆,包覆效果良好;镀铜层对SiCp/Al复合材料界面有影响,所制得的复合材料界面结合良好,镀层抑制了界面相Al_4C_3的生成,促进了界面相CuAl_2的产生;在3.5%NaCl溶液中,碳化硅颗粒镀铜前后SiCp/Al复合材料的腐蚀形式均为以点蚀为主,腐蚀过程相似,但镀铜后SiCp/Al复合材料表面更早形成钝化膜;相对于未镀铜碳化硅制得的SiCp/Al复合材料,化学镀铜后制得的SiCp/Al复合材料早期更易发生腐蚀,但在3.5%NaCl溶液中浸泡较长时间后,腐蚀速率更小。
The surface of silicon carbide particles was electrolessly plated by copper plating, and the copper-coated silicon carbide particles were fabricated by pressureless infiltration method. The SiCp / Al composites were tested for potentiodynamic polarization and electrochemical impedance spectroscopy before and after copper carbide particles were plated on copper. The results show that the particles are fully coated with Cu and the coating effect is good after electroless copper plating on SiC particles. The effect of copper plating layer on the interface of SiCp / Al composites is good. The interfacial adhesion between the composites and SiCp / In 3.5% NaCl solution, the corrosion patterns of SiCp / Al composites before and after copper carbide particles are all pitting corrosion, the corrosion process is similar, but in the 3.5% NaCl solution, the formation of Al_4C_3 promoted the formation of interfacial phase CuAl_2. / Al composites. The SiCp / Al composites prepared by electroless copper plating were more likely to corrode in the early stage than SiCp / Al composites made of uncoated silicon carbide. However, in the early stage of 3.5% NaCl After immersion in solution for a long time, the corrosion rate is smaller.