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采用核壳聚合物(Core-Shell Polymer,CSP)粒子改性环氧树脂,通过红外光谱、热力学分析和扫描电镜研究了CSP粒子对环氧树脂基体热膨胀系数(CTE)的影响。结果表明:CSP粒子壳材料分子链中的羰基在环氧树脂固化过程中可与环氧分子侧链上的羟基形成氢键作用,从而加强了核壳聚合物粒子与环氧树脂的界面作用。随着CSP粒子质量分数的增加,改性环氧树脂基体的玻璃化转变温度呈下降趋势;相对于纯环氧树脂,改性环氧树脂在玻璃化转变温度下的CTE呈现先下降后上升的趋势,添加质量分数为0.5%的CSP后,其CTE值降低了12.88%。但在玻璃化转变温度上的热膨胀系数均高于纯环氧树脂。
The effects of CSP particles on the thermal expansion coefficient (CTE) of epoxy resin matrix were investigated by IR, thermodynamic analysis and scanning electron microscopy using Core-Shell Polymer (CSP) modified epoxy resin. The results show that the carbonyl groups in the molecular chain of CSP shell material form hydrogen bonding with the hydroxyl groups on the side chains of the epoxy during the curing of the epoxy resin, thereby enhancing the interfacial interaction between the core-shell polymer particles and the epoxy resin. With the increase of CSP particle size, the glass transition temperature of the modified epoxy resin matrix tends to decrease. Compared with the pure epoxy resin, the CTE of the modified epoxy resin first decreases and then increases Trend, after adding 0.5% mass fraction of CSP, its CTE decreased by 12.88%. However, the coefficient of thermal expansion at glass transition temperature is higher than pure epoxy resin.