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概述按晶体学观点,断口可分为晶体学断口和非晶体学断口两种类型。晶体学断口是指裂纹沿着一定的晶体学平面萌生及扩展所形成的断口,在断裂过程中不发生或发生较小的塑性形变,晶体学断口形貌与晶体位向有密切的关系;非晶体学断口是指裂纹在萌生及扩展过程中发生塑性形变,断口形貌与晶体位向没有直接关系。断口形貌与晶体位向之间的关系除了受断口类型影响以外,还受材料的化学成份、晶体结构、热处理条件、显微组织、应力状态及其环境介质等因素的影响。当这些因素发生变化时,其断口形貌与晶体位向之间的关系均相应地变化。
Overview According to the crystallography point of view, fracture can be divided into two types of fracture and non-crystallographic crystallography. Crystallographic fracture refers to the fracture along a certain crystallographic plane initiation and expansion of the fracture formed in the fracture process does not occur or less plastic deformation, the crystal morphology and crystal fracture has a close relationship; Crystallographic fracture refers to the plastic deformation during the initiation and propagation of the crack. The fracture morphology is not directly related to the crystal orientation. In addition to the fracture type, the relationship between the fracture morphology and the crystal orientation is affected by chemical composition, crystal structure, heat treatment conditions, microstructure, stress state and its environmental medium. When these factors change, the relationship between the fracture morphology and the crystal orientation changes accordingly.