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研制了一个设计半导体器件封装用的软件:HISETS(日立半导体热强度设计系统),将五个程序联结在一起,以实现对六个重要的封装设计参数作统一的分析,(1)热阻;(2)热变形;(3)热应力;(4)芯片和衬底的热阻;(5)键合层寿命;(6)由应力引起的电特性变化。通过反复模拟修改结构,直到计算结果满足设计规范,可以很快地获得合适的结构,
Developed a software package designed for semiconductor device packaging: HISETS (Hitachi Semiconductor Hot Strength Design System), the five programs linked together to achieve the six important package design parameters for a unified analysis, (1) thermal resistance; (2) thermal deformation; (3) thermal stress; (4) thermal resistance of the chip and the substrate; (5) lifetime of the bonding layer; and (6) change of electrical characteristics due to stress. By iteratively mocking the structure until the result of the calculation meets the design specifications, a suitable structure can be quickly obtained,