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对纯镍及其表面离子注镧样品在900℃空气中的恒温氧化规律进行了研究。采用扫描电子显微镜(SEM)和透射电子显微镜(TEM)对NiO膜的微观形貌和结构进行测试。采用激光拉曼(Raman)谱和X射线衍射仪(XRD)对两种样品表面氧化膜的应力状态进行测量。采用二次离子质谱(SIMS)对氧化膜内元素Ni、O和La的深度分布情况进行了测量。结果表明,离子注镧显著降低了镍的恒温氧化速率,细化了表面NiO膜的晶粒尺寸,同时,将氧化膜生长的生长机制由未注镧前Ni2+阳离子向外扩散转变为注镧后O2-阴离子向内扩散为主。X射线衍射和激光拉曼测量均反映出注镧引起的膜内应力降低效应,并且,结合氧化膜内应力深度分布的不均匀性及膜生长过程中存在的稀土元素效应对两种应力测量结果之间存在的偏差进行了细致分析。
The regular oxidation of pure nickel and its surface ion-lanthanum samples at 900 ℃ in air was studied. The microstructure and morphology of NiO films were tested by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The stress state of the oxide film on the two samples was measured by Raman spectroscopy and X-ray diffraction (XRD). The depth distribution of Ni, O and La in the oxide film was measured by SIMS. The results show that the ion-lanthanum significantly reduces the constant temperature oxidation rate of nickel and the grain size of the surface NiO film. At the same time, the growth mechanism of the oxide film changes from the out-diffusion of Ni2 + O2- anion diffusion inward mainly. X-ray diffraction and laser Raman measurements both reflect the effect of lanthanum-induced stress reduction in the film, and combined with the inhomogeneity of the depth of stress distribution in the oxide film and the rare earth element effect existing in the film growth process, The deviation between the existence of a detailed analysis.