论文部分内容阅读
本文分别对 ２００ｋｅＶＡｒ＋注入 Ｃｕ及 Ｃｕ－Ｃｒ双层的表面硬度和电阻，以及上 述性质的时效效果进行了测量；同时进行了ＴＥＭ分析，发现Ａｒ＋注入Ｃｕ晶粒随剂量 逐渐细化，而Ｃｕ－Ｃｒ双层混合，在１０１７／ｃｍ２Ａｒ＋注入剂量时，ＴＥＭ形貌图出现了 沟纹，为一离子择优溅射效果。此时形成了单一的 Ｃｕ基亚稳相固溶体。经 ２００℃退 火，有孪晶生成，Ｃｒ沉淀析出。
In this paper, the surface hardness and electrical resistance of 200keVAr + Cu and Cu-Cu bilayers and their aging effects were measured respectively. The TEM analysis showed that the Cu grains infiltrated with Ar + In the double-layer mixing, the morphology of the topography of the TEM appears as the groove at the dose of 1017 / cm2Ar + implantation, which is an ion selective sputtering effect. At this point, a single Cu-based metastable phase solid solution was formed. After annealing at 200 ℃, twins are formed and Cr precipitates.