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1月19日,“全球首款40 nm低功耗商用TD-HSDPA/TD-SCDMA多模通信芯片报告会”在北京举行。这代表着全球首款40 nm低功耗商用TD-HSDPA/TD-SCDMA多模通信芯片正式发布,是TD-SCDMA商用终端芯片发展历程中一个新的里程碑。工业和信息化部副部长杨学山、科技部副
January 19, “World’s First 40 nm Low-Power Commercial TD-HSDPA / TD-SCDMA Multi-Mode Communication Chip Conference” was held in Beijing. This represents the world’s first low-power 40 nm commercial TD-HSDPA / TD-SCDMA multi-mode communication chip officially released, TD-SCDMA commercial terminal chip development process in a new milestone. Vice Minister Yang Xueshan of Ministry of Industry and Information Technology, Vice Minister of Science and Technology