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基于M-S理论的基本思路建立了电流作用下的凝固界面形态稳定性动力学微分方程式，并讨论了电流强度对稳定性及凝固过程达到稳定状态时所对应的扰动频率的影响．在此基础上讨论了电流改变定向凝固单相合金枝晶间距的机理．
Based on the basic idea of M-S theory, the dynamic differential equation of the solidification interface morphology under the action of current is established. The influence of the current intensity on the stability and the perturbation frequency when the solidification process reaches the steady state is discussed. On the basis of this, the mechanism that the current changes the dendrite spacing of the directional solidification single-phase alloy is discussed.