一、引言 通常人造金刚石和立方氮化硼复合刀片,是在3mm厚的硬质合金基体上分别烧结一层约0.5mm厚的聚晶金刚石和立方氮化硼聚晶而制成的。这两种复合刀片先用电火花线切割把硬质合金基体切至非导电的聚晶层,之后用手掰成小块焊在刀体上,磨出需要的几何角度。但在掰片时常常会出现掰不齐的弊病。 本文探讨用激光对聚晶层进行划片时,对激光器输出特性的要求,工艺参数的估算及工艺参数因素水平的最佳组合,以提高划片后的掰片质量。 I. Introduction Usually synthetic diamond and cubic boron nitride composite blade is sintered in 3mm thick cemented carbide substrate were about 0.5mm thick polycrystalline diamond and cubic boron nitride polycrystalline and made. The two composite blades first wire-cut tungsten carbide substrate cut to non-conductive polycrystalline layer, and then broken into small pieces by hand in the knife body, grinding out the required geometric angle. However, often breaking the film when breaking the ills. In this paper, the optimal combination of lasers’ output characteristics, process parameters estimation and process parameter factors are discussed in order to improve the quality of the wafer after dicing.