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Crolles 2联盟成员飞思卡尔、飞利浦与意法半导体扩大了该联盟的半导体合作研发范围,合作项目除最初的100 nm以下的CMOS制造工艺外,还包括了相关的芯片检测与封装的研发活动。这项协议反映了采用90 nm、65 nm及以下的CMOS制造技术的300 nm晶圆对封装测试的特殊需求,合作三方将考虑晶圆后端制造流程中的所有过程,包括检测、研磨、锯切、芯片链合、引线键合、倒装芯片及封装制模等技术以及键合点优化方法。
Crolles 2 alliance members Freescale, Philips and STMicroelectronics have expanded their alliances in the area of semiconductor research and development cooperation, in addition to the first 100 nm CMOS manufacturing process below, but also related to the chip detection and packaging research and development activities. This agreement reflects the special needs of 300-nm wafers for package testing using CMOS manufacturing technology at 90 nm, 65 nm and below. The three parties will consider all the processes in the wafer back-end manufacturing process including inspection, grinding, sawing Cutting, chip bonding, wire bonding, flip chip and package molding technology and bonding point optimization methods.