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为了进一步提高半导体集成电路的集成度,如何把微细图形制作在片子上成了重要课题。目前以普通光学手段的光刻方式仍占主流,但由于光的波长引起的衍射效应的影响,从根本上说已达到了分辨率的极限。为减少这个不良影响,人们正在研究远紫外曝光方法,为了前更进一步,于是出现了X线光刻技术,本文将谈谈X线光刻的研究概况及实用的可能。目前虽然还没有听到用X线光刻法成功地制造LSI的报道,但是其可能性是很大的,而且在各个领域正在踏实地进行着它的研究工作。下边以一年来报道的较新的研究成果为中心介绍一下X线光刻的现状。
In order to further improve the integration of semiconductor integrated circuits, how to make fine graphics on the film has become an important issue. At present, the lithography method using ordinary optics still occupies the mainstream, but the resolution limit is basically reached due to the diffraction effect caused by the wavelength of light. To reduce this adverse effect, people are studying far UV exposure method, in order to go further, so there X-ray lithography, this article will talk about X-ray lithography research overview and practical possibilities. At present, although the successful fabrication of LSI by X-ray lithography has not been heard yet, the possibility is great and its research work is steadily going on in various fields. The following is a brief introduction of the current state of X-ray lithography based on the newer research reported in a year.