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对冷拉拔的亚微米晶Cu-5wt%Cr合金丝材进行350~1000℃退火处理,用透射电镜分析了退火后合金回复与再结晶以及Cr相析出的变化,并测定合金硬度、强度、伸长率和电导率的变化。结果表明,冷拉拔的亚微米晶Cu-5wt%Cr丝材在450℃左右退火后析出大量Cr相颗粒,其再结晶软化温度为480~560℃。经550℃退火,得到了晶粒尺寸为200~300 nm的再结晶组织。其电导率在550℃左右退火时出现峰值。冷拉拔的亚微米晶Cu-5wt%Cr丝材在600℃以上退火,其组织和性能趋于稳定。经800℃高温退火,Cu基体晶粒长大到500~600 nm,仍保持在亚微米级。Cr相颗粒有阻碍Cu基体晶粒长大的作用,从而使亚微米晶Cu-5wt%Cr的组织和性能比较稳定。
The cold-drawn submicron Cu-5wt% Cr alloy wire was annealed at 350 ~ 1000 ℃. The changes of the alloy’s recovery, recrystallization and Cr phase after annealing were analyzed by transmission electron microscopy. The hardness, Elongation and conductivity changes. The results show that a large amount of Cr phase particles are precipitated from the cold-drawn submicron Cu-5wt% Cr wire after annealing at about 450 ℃. The recrystallization softening temperature is 480-560 ℃. After annealing at 550 ℃, a recrystallized structure with a grain size of 200 ~ 300 nm was obtained. Its conductivity at about 550 ℃ annealing peak. Cold-drawn sub-micron Cu-5wt% Cr wire annealed above 600 ℃, its microstructure and properties tend to be stable. After high temperature annealing at 800 ℃, Cu matrix grains grow up to 500-600 nm and remain at submicron level. Cr phase particles have hindered the growth of Cu matrix grain, so that the sub-micron Cu-5wt% Cr microstructure and properties of relatively stable.