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随着集成电路特征尺寸的不断减小,功率密度逐渐增加,电路的热分析和热管理越来越受到人们的重视。文章研究了一种基于延迟插入法的温度场仿真技术,首先通过电场和热场的等效原理建立热路网络,然后在热路的支路和节点上补充必要的辅助热感和热容项,从而构建迭代的求解格式,对温度场进行快速求解。与传统的仿真方法相比,延迟插入法不需要构造和求解大型稀疏矩阵,在内存消耗和计算效率上具有优势。数值算例验证了文章方法的有效性和准确性。
With the ever decreasing feature size of integrated circuits, the power density is gradually increasing. Thermal analysis and thermal management of circuits are gaining more and more attention. In this paper, we study a temperature field simulation technique based on delay-insertion method. Firstly, the thermal network is established by the equivalent principle of electric field and thermal field, and then the necessary auxiliary thermal and heat capacity terms are added to the branches and nodes of the hot circuit , So as to construct an iterative solution format and solve the temperature field quickly. Compared with the traditional simulation methods, the delay insertion method does not need to construct and solve large sparse matrix, and has advantages in memory consumption and computational efficiency. Numerical examples demonstrate the effectiveness and accuracy of the proposed method.